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Octafluorocyclobutane is an important etching gas in the plasma etching process of the electronics industry.
Chemical Name | Octafluorocyclobutane |
Synonyms | Perfluorocyclobutane, R-C318 |
CAS # | 115-25-3 |
ELINCS # (EU) | 204-075-2 |
Molecular Formula | CC4F8 |
Structure | |
Molecular Weight | 200.03 |
ODP(CFC-11 = 1) | 0 |
GWP100(CO2 = 1) | 3200 |
Atmospheric Life Time (Days) | 10300 |
Chemical Name | Octafluorocyclobutane |
Boiling Point(℃) | -5.8 |
Melting Point(℃) | -40.1 |
Liquid Density ( -5.8℃, g/cm³) | 1.637 |
Vapor Density (Air=1) | 7.0 |
Saturated Vapor Pressure(@20℃, bar) | 2.7 |
Critical Temperature(℃) | 115.3 |
Critical Pressure(MPa) | 2.79 |
Solubility in water (mg/L) | 140 |
Flash Point(℃) | Not applicable (non-flammable) |
Flammability (@21℃) | Not applicable (non-flammable) |
Explosion Limit(%vol) | Not applicable (non-flammable) |
Purity | 99.9% | 99.99% |
Cylinder Size | Valve Type | Filling Weight |
10.2L | CGA 660 / DISS 716 | 10kg |
44L | CGA 660 / DISS 716 | 44kg |
47L | CGA 660 / DISS 716 | 47kg |
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