High purity C4F6 with the purity 4N Introduction

March 5th 2022

Hexafluoro-1,3-butadiene (C4F6), also known as HFBD, is a colorless, odorless, flammable liquefied gas. As an environmentally friendly fluorine chemicals with low GWP, C4F6 has become one of the most advanced dry etching gases with a low C/F ratio and unsaturated bonds. C4F6 shows many application advantages in plasma, ion beam or sputter dry etching in semiconductor devices manufacturing.
The physical properties, package and shipping information for C4F6 are as follows.

Physical Data

Molecular Weight 162
Boiling Point (℃) 6
Vapor Pressure (bar, @0 ℃) 19.65
Critical Temperature (℃) 136.75
Critical Pressure (kPa) 3131
Liquid Density (g/ml) 1.553
GWP (100years) 290
ODP 0

 

Cylinder Data

Cylinder Size(L) Fill Weight(kg) Valve Outlet
10.2 10 CGA 350
47 47 CGA 350

Specify CGA & Other cylinder connections are also available–please contact YUJI representative.

Shipping Information

DOT Name: Hexafluoro-1,3-butadiene

DOT Hazard Class: 2.1; Subsidiary Class: 2.1

UN No.: UN 3160

DOT Label: Liquefied gas, toxic, flammable, Inhalation Hazard Zone C

CAS No.: 685-63-2

Applications

Used as a dry etching gas in silicon-based integrated circuits

Application advantages:

Higher aspect ratio

Low C/F ratio and insaturations lead to narrow and deep grooves for processing at very narrow line widths (as narrow as 45-25nm)

Higher selectivity

Compared with octafluorocyclobutane (c-C4F8), C4F6 is sensitive to silicon dioxide over photoresist, silicon substrate or nitride film. Only the dielectric substrate can be etched.

Less VOC emissions

 

The global warming potential of C4F6 is only about 0.1, resulting in a much shorter lifetime in the atmosphere.

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